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. 2020 Sep 7;20(18):5101. doi: 10.3390/s20185101

Figure 7.

Figure 7

Board/Package Area Projection with Different Levels of Design Integration, starting from the current prototype with the PCB size of 104 cm2, followed by an optimised PCB with a 20% components density and a design for manufacturability (DFM) design with a 50% components density; further minimisation could be performed by a stacked PCB or SiP (system in package) design, or by the chip-level FPAA/SoC design.