Table 8.
Waferboard panels analysis, MFC 10% increasing levels, resin stable, Approach 2.
| Formulation | MUF Reference | MUF + 0.25% MFC | MUF + 0.50% MFC | MUF + 0.75% MFC | MUF + 1.00% MFC |
|---|---|---|---|---|---|
| % Binder, dry/dry wood | 12.0 | 12.0 | 12.0 | 12.0 | 12.0 |
| % MFC, dry/liquid resin | 0.00 | 0.25 | 0.50 | 0.75 | 1.00 |
| Internal bond (MPa) | 0.50 (0.06) | 0.49 (0.08) | 0.51 (0.10) | 0.52 (0.03) | 0.61 (0.06) |
| 24 h Thickness Swelling (%) | 22.1 (2.1) | 24.5 (2.8) | 22.4 (0.8) | 20.8 (0.9) | 19.8 (5.3) |
| 24 h Water Absorption (%) | 61 (2.2) | 68 (3.3) | 65 (7.4) | 60 (7.2) | 61 (6.3) |
| Modulus of Rupture (MPa) | 21.4 | 20.8 | 23.1 | 22.1 | 24.1 |
| Modulus of Elasticity (MPa) | 3395 | 3257 | 3679 | 3820 | 3789 |
| Formaldehyde content (mg/100 g ODB) | 7.4 | 6.8 | 7.4 | 7.8 | 7.5 |