. 2020 Oct 21;25(20):4846. doi: 10.3390/molecules25204846

Table 17.

Conclusions and general evaluation.

Application	Approach	MFC Addition Level, % Dry MFC/Liquid Resin	MFC Grade	Property	Outcome	Remarks
Particleboard	1	0.22–0.32%	2% suspension	Mechanical properties (Internal Bond, Modulus of Rupture, Modulus of Elasticity)	Negative
				Wet properties (Thickness swelling, Water absorption)	Negative
				Formaldehyde content	Positive
	3	0.22–0.32%	2% suspension	Mechanical properties (Internal Bond, Modulus of Rupture, Modulus of Elasticity)	Positive
				Wet properties (Thickness swelling, Water absorption)	Neutral
				Formaldehyde content	Neutral
	2	0.25–1.00%	10% paste	Mechanical properties (Internal Bond, Modulus of Rupture, Modulus of Elasticity)	Positive	Allows reduction in resin, maintaining board properties
				Wet properties (Thickness swelling, Water absorption)	Neutral
				Formaldehyde content	Neutral
	3	0.01–0.03%	2% suspension	Mechanical properties (Internal Bond, Modulus of Rupture, Modulus of Elasticity)	Positive	Allows reduction in resin, maintaining board properties
				Wet properties (Thickness swelling, Water absorption)	Positive
				Formaldehyde content	Positive
Waferboard	2	0.25–1.00%	10% paste	Mechanical properties (Internal Bond, Modulus of Rupture, Modulus of Elasticity)	Positive	Allows reduction in resin, maintaining board properties
				Wet properties (Thickness swelling, Water absorption)	Neutral
				Formaldehyde content	Neutral
Plywood	1	0.22%	2% suspension	Shear strength	Positive
	1	0.22%	2% suspension	Wood failure	Neutral
	2	0.23–0.68%	10% paste	Shear strength	Neutral	Can substitute conventional thickeners, maintaining board properties
	2	0.23–0.68%	10% paste	Wood failure	Neutral