Table 3.

Effect of trace element addition on the wettability of In-based/Sn-Bi/Sn-Zn solder.

Solder	Elements	wt.%	Spreading area	Contact angle	wetting time	reliability	Reference
In	Ag	7	↑				[11]
	Sn, Zn	20, 10	↑				[14]
	Bi, Zn	32.7, 0.5	↑↑	↓			[15]
	Bi	15	↑ (12%)				[20]
	Ag	3.7	↑				[21]
	Cu	0.5		↓↓ (52%)		√	[22]
	Zn, Al	2, 0.05	↑				[25]
Sn-Bi	In	2.5	↑ (15%)				[26]
	Sb	2	↑ (21.2%)			√	[27]
	Ce	0.1	↑↑				[32]
	Nano-Ni	0.5	↑				[33]
	Ti nanoparticle	0.1	↑	↓			[114]
	Ag	1	↑			√	[36]
	Bi, Ni	3, 1		↓↓			[37,38]
	Cu	10		↓↓ (55%)			[39]
	Zn	6.5	↑↑ (31.2%)				[40]
	Ni	0.1		↓			[41]
Sn-Zn	Al	0.005–0.02	↑↑				[42]
	Al	0.6		↑			[43]
	Ag, Ga	0.5, 0.5	↑				[45]
	RE(La)	0.08	↑ (18%)				[47]
	Nd	0.06	↑↑ (33.3%)			√√	[48]
	Pr	0.08			↓↓ (50%)	√	[49]

Notes:↓ = slightly decreased

↓↓ = remarkably decreased

↑ = slightly increased

↑↑ = remarkably increased

√ = slightly improved

√√ = remarkably improved