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. 2020 Oct 29;10:18672. doi: 10.1038/s41598-020-75393-y

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© The Author(s) 2020

Open AccessThis article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.

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The pressure dependence of (a) through-plane electrical conductivity and (b) through-plane thermal conductivity with (c) through-plane compression strain. The relative increase of the through-plane thermal and electrical conductivities at 1080 kPa relative to 100 kPa is shown in (d). Only the $140 mg {cm}^{- 2}$ samples are shown to improve plot clarity. A schematic of the change of NGS structure with through-plane compression is shown in (e).