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. 2020 Oct 15;13(20):4590. doi: 10.3390/ma13204590

Figure 18.

Figure 18

Atomic force microscope (AFM) images of blanket copper wafers: (a) before CMP, root mean square (RMS) roughness 8.47 nm, (b) after CMP by colloidal silica abrasive, RMS roughness 4.27 nm, (c) after CMP by PS@SiO2 abrasive, RMS roughness 0.56 nm [16]. Reproduced with permission from [Lei Zhang et al.], [Applied Surface Science]; published by [Elsevier], 2011.