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. 2020 Nov 8;20(21):6364. doi: 10.3390/s20216364

Figure 1.

Figure 1

(a) The sensor chip (10 × 40 mm2 outer dimensions), with the extended-gate gold electrode (sensing area 20 mm2) and two Ag/AgCl pseudoreferences (dark semicircular area around the gold sensing area), connected to the home-made printed circuit board, where the commercial n-type MOSFET ALD110900A is plugged in and four plugs are available to connect the printed circuit board (PCB) with the source-meter units (SMUs). (b) Sketch of the microfabrication process of the sensor chip.