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. 2020 Nov 13;6(46):eabc6800. doi: 10.1126/sciadv.abc6800

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Copyright © 2020 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC).

This is an open-access article distributed under the terms of the Creative Commons Attribution-NonCommercial license, which permits use, distribution, and reproduction in any medium, so long as the resultant use is not for commercial advantage and provided the original work is properly cited.

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Fig. 2 — (A) Stretchable electronics before laser cutting. (B) The selective laser-cutting process. The rastering path of the laser is depicted. (C) Stretchable electronics after postprocessing. Inset shows the underlying PI preserved after the laser-cutting process. (D) Cross-sectional (end-on) confocal image of the electronics before laser cutting. Scale bar, 0.1 mm. (E) Cross-sectional (end-on) confocal image of the electronics after laser cutting. Scale bar, 0.1 mm. (F) SEM image of the final laser-cut stretchable electronics. Scale bar, 0.3 mm. (G) Results for the tensile test are shown between preprocessed and postprocessed sensor arrays. The stretchability of the postprocessed sensor arrays can be clearly observed.