Table 4.

Residues involved in the H-bond formation with percentage of how long this bond was present during the entire 10 ns of simulation.

Ligand	Residues Involve in the H-Bond Formation with the Major Contribution
Ligand1	LYS441 (54.20%), LYS331 (35.88%), PHE330 (7.11%), PHE329 (2.80%)
Ligand2	LYS441 (85.28%), PHE329 (9.37%), PHE330 (4.97%)
Ligand3	LYS441 (38.70%), PHE329 (24.17%), PHE330 (19.74%), LYS331 (17.39%)
Ligand4	LYS441 (52.68%), LYS331 (24.05%), PHE330 (19.28%), PHE329 (3.99%)
Ligand5	LYS441 (54.31%), PHE330 (35.45%), LYS331(9.31%)
Ligand6	LYS441 (36.13%), LYS331 (23.48%), PHE330 (17.81%), ASN334 (17.03%), LYS332 (4.77%)
GTP	ARG445 (39.05%), LYS331 (34.63%), LYS441 (17.35%), PHE330 (8.12%)