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. Author manuscript; available in PMC: 2021 Oct 22.
Published in final edited form as: Phys Med Biol. 2020 Oct 22;65(21):21RM01. doi: 10.1088/1361-6560/ab9500

Figure 15.

Figure 15.

Example of a 3D digital SiPM. The top tier is composed of a SPAD array, while the bottom tier contains the readout electronics. In this example, a through silicon via (TSV) is used to interconnect one-to-one each SPAD with its readout channel. This device is front-side illuminated.