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. 2020 Nov 26;13(23):5371. doi: 10.3390/ma13235371
3D-DIC Three-dimensional digital image correlation (3D-DIC)
AOI Area of interest
CH Conoscopic holography
CS Confocal sensor
CSI Computational shear interferometry
CLA Chromatic light aberration phenomenon
CLSM Confocal laser scanning microscopy
CMM Coordinate measuring machine
CT X-ray computed tomography
DIA Digital image acquisition
EDS Energy-dispersive X-ray spectrometry
EDXRF Energy-dispersive X-ray fluorescence spectrometry
EMA Electron microprobe analysis
FP Fringe projection
FVM Focus variation microscopy
GRT Gamma-ray transmission
LAMQS Laser ablation coupled to mass quadrupole spectrometry
LIBS Laser-induced breakdown spectroscopy
MI Moiré interferometry
ND Neutron diffraction
OM Optical microscopy
PIXE Particle (proton)-induced X-ray emission
PS Phase stepping
RBS Rutherford backscattering spectrometry
XPS X-ray photoelectron spectroscopy
XRD X-ray diffraction
SEM Scanning electron microscopy
SL Structured light
SP Speckle projection
SRXRF Synchrotron radiation X-ray fluorescence spectrometry
TEM Transmission electron microscopy
TPU Temporal phase unwrapping
WD Working distance, mm
Sa Arithmetic mean deviation of the surface, µm
Sku Kurtosis of the height distribution, -
Sp Maximum height of summits, µm
Sq Root-mean-square deviation of the surface, µm
Ssk Skewness of the height distribution, -
St Total height of the surface, µm
Sv Maximum depth of valleys, µm