Table 1.

Measurements of 15 different negative molds after fabrication as well as their variations as compared with the originally designed dimensions for both PDMS substrates for the grid micropattern formation and Si substrates for pillar micropattern formation (n = 3).

Micropattern prototype	Dimension originally designed [μm]	Measurement (n = 3) [μm]	Variation [%]
Sample ID 1–4
1
Grid-rectangular
Height	200	206.0 ± 0.82	+ 3.0
Thickness	100	117.0 ± 0.47	+ 17.0
2
Grid-truncated
Height	200	227.0 ± 2.90	+ 14.0
Thickness	100	119.0 ± 2.90	+ 19.0
3
Pillar-rectangular
Height	200	206.0 ± 1.30	+ 2.8
Diameter	200	200.0 ± 0.00	0.0
4
Pillar-truncated
Height	200	184.0 ± 5.60	− 7.8
Diameter	200	201.0 ± 0.00	+ 0.5
Sample ID 5–8
5
Grid-rectangular
Height	100	96.3 ± 2.90	− 3.7
Thickness	100	107.0 ± 0.82	+ 7.0
6
Grid-truncated
Height	100	85.3 ± 1.90	− 14.7
Thickness	100	119.0 ± 2.90	+ 19.0
7
Pillar-rectangular
Height	100	100.0 ± 0.00	0.0
Diameter	100	114.0 ± 0.82	+ 14.0
8
Pillar-truncated
Height	100	75.9 ± 0.48	− 24.1
Diameter	100	80.7 ± 1.90	− 19.3

Micropattern prototype: grid-rectangular	Dimension originally designed [μm]	Measurement (n = 3) [μm]	Variation [%]
Sample ID 9–15
9
Height	100	90.1 ± 2.15	− 9.9
Thickness	50	51.8 ± 0.35	3.6
Channel width	100	83.5 ± 2.14	− 16.5
10
Height	100	94.5 ± 5.31	− 5.5
Thickness	100	100.0 ± 0.76	0.2
Channel width	50	37.5 ± 1.25	− 25.1
11
Height	100	91.3 ± 1.89	− 8.7
Thickness	50	52.0 ± 0.35	4.0
Channel Width	50	38.1 ± 1.20	− 23.8
12
Height	50	48.5 ± 1.10	− 2.9
Thickness	100	95.2 ± 1.25	− 4.8
Channel width	100	86.9 ± 0.69	− 13.1
13
Height	50	46.3 ± 2.52	− 7.4
Thickness	50	51.0 ± 0.60	2.0
Channel Width	100	85.4 ± 0.00	− 14.6
14
Height	50	45.7 ± 0.35	− 8.6
Thickness	100	98.5 ± 1.29	− 1.5
Channel width	50	42.0 ± 1.31	− 16.1
15
Height	50	46.1 ± 0.60	− 7.8
Thickness	50	52.2 ± 1.85	4.5
channel width	50	39.1 ± 0.35	− 21.8