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. 2020 Nov 28;11(12):1051. doi: 10.3390/mi11121051

Figure 8.

Figure 8

MEMS fabrication processing. (a) Mirror frame deposit. (b) Pt heating sputtering. (c) W layer sputtering. (d) Connection layer sputtering. (e) Protecting and pad layer deposit. (f) Backside etching. (g) MEMS structure etching. (h) Final release.