Figure 3.

Line profile scan of FLMP etch area (1500 µm × 1500 µm) machined into borosilicate glass substrate at ${\mathrm{PS}}_{\mathrm{CNC}}$ of 0.1 mm/s and ${\mathrm{LF}}_{\mathrm{av}}$ of 329.06 J/cm². The profile was recorded at 5 µm/s, 10 Hz, and 2 mg applied force. The inclined etch surfaces make a contact angle (θ) of ~8° with the vertical plane.