Figure 18.

a) Process for fabricating end‐contacted horizontal CNT interconnects via growth catalyst patterning, CNT compaction, and oxidation etching. b) SEM image, c) AFM image, and d) AFM line profile of an end‐contacted horizontal CNT interconnect fabricated with the technique. Reproduced with permission.^{[ 356c ]} Copyright 2013, Elsevier. e) Method for nanoscale template‐based CNT fluidic assembly of high density and aligned SWCNT interconnect structures. f) SEM images of the fabricated SWCNT interconnects and g) enlargement of the morphology. Scale bars 2 µm and 200 nm, respectively. Reproduced with permission.^{[ 110h ]} Copyright 2009, American Chemical Society.