Table 1.

Plasma-activated interfaces for biomedical engineering.

Type of surfaces	application	Plasma sources	Other remarks/mechanisms
Direct interfaces activated by nonthermal plasma	Bacterial killing	CAP jet with Ar [61], DBD with mixture of He and O2 [62], air [[63], [64], [65]], mixture of O2, CO2 and N2 [66]	Oxidation, membrane damage, cell leakage in S. aureus, E. coli, fungi in plant
	Anticancer	FE-DBD with air [67], DBD powered by AC [68] with N2 [67], CAP with He [69,70], DBD assisted Au nanoparticle [71], CAP integrated with microneedles [72]	MMP decrease, mitochondrial enzymatic dysfunction, and mitochondrial morphological alteration in lung [68,69], apoptosis in cervical [73], targeting the cell cycle in Keratinocytes cells [70] and glioblastoma [71]
	Dermatological diseases	DBD [74], kinpen09 with Ar [75], DBD with air [76,78], He [77], CAP powered by AC with Ar [[79], [80], [81]]	T cells proliferation [75], ulcustreatment [76], promoting inflammation, re-epithelialization and wound contraction in cutaneous wound [79], inhibiting the proliferation of the hyperproliferative keratinocytes [80], stimulating angiogenesis [81], clearance of early inflammation [77,78]
Indirect interfaces activated by plasma	Bacterial killing	Ag PIII [[82], [83], [84], [85]], Ag deposited DLC [86], codoping of Mg and Ag [87], PIII of Zn on Ti [88], $N_2^{+}$ immersion in polyurethane [89] and PEEK [90], N PIII on Ti–6Al–4V [91], combination of O and N PIII [92], O and H2O immersion in Ti [93]	Killing via Ag+ leaching [82,83], electron transfer at the interface [84,85], Zn2+ leaching [88], increased hydrophilicity [89], electrostatic repelling [91], formation of polar groups [92]
	Enhanced biocompatibility	Ceramic-like structure by Si–Ag PIII [94], codoping of Mg and Ag [87], Zn PIII on Ti [88] and TiO2 [95,96], O PIII on Ti [97,98], O plasma modified PEEK [99], combination of Ag and N PIII [100]	Regulating the iNOS and nNOS signal pathways [94], galvanic effects matters [87], stimulating proliferation of osteoblastic MC3T3-E1 cells as well as rat mesenchymal stem cells [88,95,96], higher TiO2 component [97], enhanced blood response [97], the surface topography enhanced osseointegration [99]
	Corrosion resistance/wear resistance	Ag deposited DLC [86], O PIII on Ti [97], N PIII on Ti–6Al–4V [91], Ti–O/Ti–N coating on Ti [101]	Enhancement of the passive region of Ti specimens [97], formation of TiN [91]
	Surface etching	Silicon etching [102], O2 plasma etching [103]	Superhydrophobic and superoleophobic surfaces [103]