Table 1.

Composition of materials used in this study with application protocol.

Material [Manufacturer]	Composition	Application protocol
Clearfil SE Bond 2 [Kuraray Noritake Dental]	Primer: •MDP •Water •HEMA •Hydrophilic dimethacrylate •CQ •N, N-Diethanol p-toluidine pH = 2 Bond: •Bis-GMA •HEMA •MDP •Hydrophobic dimethacrylate •Colloidal silica •CQ •Initiators •Accelerators •N, N-Diethanol p-toluidine pH: 2	Application of primer for 20 s, drying with mild air flow, application of bond and even distribution with flow, light curing for 10 s.
Tetric-N Bond Universal [Ivoclar/Vivadent]	•Bis-GMA •HEMA •MDP •MCAP •D3MA •Ethanol •Methacrylated phosphoric acid ester •CQ •2-dimethylaminoethyl methacrylate pH: 2.5	Active application on the enamel and dentin surfaces for at least 20 s. Air-drying, curing for 10 s.
Tetric-N Bond Self-Etch [Ivoclar/Vivadent]	•Bis-acrylamide derivative •Bis-GMA •Amino acid-acrylamide •Hydroxyl alkyl methacrylamide •Diphenylphosphine oxide •Nano silica fillers •Water •Initiators •Stabilizers pH: 1.5	Active application on the enamel and dentin surfaces for at least 30 s, air-drying with a strong stream of air, light irradiation for 10 s.
Filtek Bulk Fill Posterior Restorative [3M ESPE]	•AUDMA •UDMA •DDDMA •Fillers (Silica fillers, zirconia fillers, zirconia/silica cluster fillers, ytterbium trifluoride fillers)	Application as one increment. Light cure: occlusal 10 s, buccal 10 s, lingual 10 s

Abbreviation: MDP: 10-methacryloyloxydecyl dihydrogen phosphate, HEMA: hydroxyethyl methacrylate, CQ: camphorquinone, Bis-GMA: bisphenol-A diglycidylmethacrylate, MCAP: methacrylated carboxylic acid polymer, D3MA: 1,10-decanediol dimethacrylate, AUDMA: aromatic urethane dimethacrylate, UDMA: urethane dimethacrylate, DDDMA: 1, 12-dodecanediol dimethacrylate.