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. 2020 Dec 4;6(49):eabe1655. doi: 10.1126/sciadv.abe1655

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Copyright © 2020 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC).

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Fig. 2 — (A) A tilted exploded view layout of the constituent layers of the 2D precursor consists of a top and bottom PI layer and gold layer (trace in a serpentine geometry; width, 3 μm; thickness, 50 nm; resistance, 2.1 kilohms). (B) Photographs and FEA-predicted results of a 2D precursor (left) and corresponding 3D structure (right) after a compressive buckling process. (C) Schematic exploded view illustration of a pressure sensor that consists of PI layers, acrylic ring, FPCB, and a 3D structure encapsulated in a transparent elastomer. FEA-predicted results and (inset) magnified view of changes in strain distributions across a metal strain gauge (D) and a photograph (E) of a 3D structure under compressive strain. (F) Change in resistance of a 3D structure under compressive strain (0, 12, and 24%), with insets that show FEA results. Photo credit: Yoonseok Park, Northwestern University.