Figure 1.

DLW (direct laser writing) configuration equipped with a galvanoscanner and an f-theta-lens used in the experiments (a), 3D-DLIP workstation (developed at the Technische Universität Dresden) with a 1064 nm wavelength laser source emitting 10 ps pulses for the processing of 2D and 3D parts ((b), the visible laser beam illustrates the process), graphical representation of the used two-beam direct laser interference patterning (DLIP) principle, showing the most relevant parameters describing both the pattern and the process: ω—beam diameter; θ—beams intersection angle; Λ—laser intensity profile/ablated structure period (c) [35,42].