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. 2021 Feb 1;15(2):3171–3187. doi: 10.1021/acsnano.0c09758

Figure 9.

Figure 9

Process flow for DSLG EAM fabrication. (a) SC SLG transfer on WG. (b) SLG patterning using EBL and RIE. (c) Ni/Au contacts deposition using evaporation and lift-off. (d) 1L-hBN transfer on top. (e) Si3N4 deposition by PECVD. (f) Top layer SLG SC transfer. (g) Top SLG patterning. (h) Top contact deposition.