Figure 9.
Process flow for DSLG EAM fabrication. (a) SC SLG transfer on WG. (b) SLG patterning using EBL and RIE. (c) Ni/Au contacts deposition using evaporation and lift-off. (d) 1L-hBN transfer on top. (e) Si3N4 deposition by PECVD. (f) Top layer SLG SC transfer. (g) Top SLG patterning. (h) Top contact deposition.