Figure 2.
Hardware components of the intracellular detection system. (a) Transceiver structures are fabricated on an integrated circuit. Each chip includes a standalone transceiver and three transceivers with concentric, integrated RFIDs. Each transceiver loop is connected to a 300 m transmission line and probe pads. (b) Schematic cross section of RFIDs fabricated in the Stanford Nanofabrication Facility (SNF). (c) Top view of a loose RFID device. The device consists of an antenna (white outer ring) and a capacitor (square feature situated inside the ring), whose size and value can be modified during fabrication to generate different RFID batches with different electrical characteristics. (d) Using Kapton film as a carrier, individual RFIDs can be placed within the footprint of the transceiver antenna to be detected and identified. The probe pads must be uncovered to perform electrical measurements.