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. 2021 Mar 16;11:5967. doi: 10.1038/s41598-021-85268-5

Figure 4.

Figure 4

Cell and RFID alignment onto a transceiver. (a) Using the flip chip bonder, flip a Kapton film with a RFID in a cell onto the transceiver structure on the integrated circuit chip. (b) RFID is aligned in the transceiver loop, and probe pads are uncovered for electrical measurements. (c) Cross section schematic shows that the Kapton film pins the cell and intracellular RFID within the transceiver detection zone.