Table 1.
Thermogravimetric analysis results on different e-waste components.
| Summary of E-waste TGA analysis | ||||
|---|---|---|---|---|
| Sample source | Onset temp. (◦ C) | T50 (°C) | Tmax (°C) | Ash remaining (%) |
| Casings | ||||
| Laptop casing | 367 | 530 | 536 | 20 |
| Cellphone casing | 416 | 517 | 529 | 15 |
| Desktop cover | 412 | 439 | 441 | 2 |
| Peripheral | ||||
| Gray cable cord | 224 | 309 | 309 | 34 |
| Black cable cord | 260 | 311 | 310 | 32 |
| Keyboard | 422 | 438 | 441 | 1.5 |
| Fan | 377 | 401 | 405 | 28 |
| Printed circuit boards | ||||
| Dell PCB | 366 | 377 | 381 | 87 |
| Intel MP PCB | 354 | 368 | 366 | 23 |
| Dell PCB | 352 | 368 | 366 | 79 |
| HP RAM PCB | 334 | 440 | 444 | 77 |
| HP PCB | 323 | 368 | 369 | 64 |