Table 1.
Thermogravimetric analysis results on different e-waste components.
Summary of E-waste TGA analysis | ||||
---|---|---|---|---|
Sample source | Onset temp. (◦ C) | T50 (°C) | Tmax (°C) | Ash remaining (%) |
Casings | ||||
Laptop casing | 367 | 530 | 536 | 20 |
Cellphone casing | 416 | 517 | 529 | 15 |
Desktop cover | 412 | 439 | 441 | 2 |
Peripheral | ||||
Gray cable cord | 224 | 309 | 309 | 34 |
Black cable cord | 260 | 311 | 310 | 32 |
Keyboard | 422 | 438 | 441 | 1.5 |
Fan | 377 | 401 | 405 | 28 |
Printed circuit boards | ||||
Dell PCB | 366 | 377 | 381 | 87 |
Intel MP PCB | 354 | 368 | 366 | 23 |
Dell PCB | 352 | 368 | 366 | 79 |
HP RAM PCB | 334 | 440 | 444 | 77 |
HP PCB | 323 | 368 | 369 | 64 |