Table 8.

Transmissions in the thermal properties of various CNT–polymer composite materials based on their application.

Type of Polymer	Type of CNT	CNT Content (wt.%)	Improvement Properties	Potential Application	Reference
-	SWCNT	100 wt.%	Up to 3500 W/m·K	Heat sinks, connectors, batteries, light-emitting diode devices, automotive electronic control units, printed circuit boards, electronic assembly, and packaging	[177]
Polyacrylate composites	MWCNT	50–80 wt.%	˄ ~0.50 to 1.67 W/m K	Aerospace and aeronautics material	[183]
PLA	MWCNT	0.25–2.5 wt.%	27.5 mW·m−1K−1	High performance thermal insulator	[184]
Poly-dimethyl siloxane	MWCNT	~2 wt.%	˄ ~1.5 W/m·K	Thermal insulator/high thermal conductivity polymer composites	[185]
Poly-dimethyl siloxane/Si	MWCNT	~30%	˄ ~10% of 3000 W/m·K ≈3300 W/m·K
Polymer-based composite	CNTs	30%	1000–4000 W/m·K	Light-emitting diodes and thermal dissipation	[179]
Polystyrene	MWCNT	1%	~30.2 mW/m-K without using any insulation gas	Super-thermal insulation properties	[186]
Poly (vinylidene fluoride)	MWCNT/graphene(1:1)	10% of (s-MWCNTs)/graphene (GE)	˄ ~711.1% of 0.19 W/m·K ≈135.11 W/m·K	Heat exchanger	[187]
PC	MWCNT	2%	˄ ~1.27 W/m·K	High performance thermal insulator	[188]
Resol-type phenolic resin	MWCNT	up to 1%	˄ ~35 °C of maximum degradation temperature	Strong network char layer without any cracks or opening	[189]
Carbon prepreg (IM7) composite	SWCNT	30%	˄ 30% heat capacity	Pipes and heat exchangers, replacer material for heavy-lift rocket under the Space Launch System (SLS), and promising high performance material for future space vehicles.	[190]
			˄ 30% thermal diffusivity
			˄ ~120–150% thermal conductivity
Epoxy	MWCNT	0.3 wt.%	˄ 35–42% of critical buckling temperature	Coefficient of thermal expansion (CTE) and thermal buckling of epoxy-based composites	[191]
Epoxy	SWCNT	1 wt.%	˄ ~125% W/m·K (method raw laser-oven)	High performance thermal insulator	[90]
		3 wt.%	˄ ~30% W/m·K