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. 2021 Apr 8;12(4):414. doi: 10.3390/mi12040414

Figure 3.

Figure 3

The 2D representation of the 40-electrode DBS design with integrated electronic components. The large silicon island (18 mm × 1 mm) can contain flip-chipped ASICs. The small silicon islands (210 µm × 2070 µm) are separated with 40 µm wide trenches and can accommodate prefabricated decoupling capacitors. The flexible film contains 40 flexible electrodes.