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. 2021 May 3;13:119. doi: 10.1007/s40820-021-00637-z

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© The Author(s) 2021

Open AccessThis article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.

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Fig. 16 — a Schematic illustration of procedures for the fabrication of a freestanding and transferrable 3D nanostructured TE film. b Structural unit cell of a 3D nanostructured Bi_1.5Sb_0.5Te₃ film illustrating the concept of increasing phonon boundary scattering without altering electrical transport. Comparison of c electrical conductivity and d thermal conductivity of the 3D nanostructured and ordinaryBi_1.5Sb_0.5Te₃ films as a function of temperature. Adapted with permission from Ref. [209]