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. 2021 Feb 22;203(6):e00661-20. doi: 10.1128/JB.00661-20

TABLE 1.

MIC values for various compounds against WT and ΔcvpA EHEC

Compound (concn) Type of stress caused MIC against:
WT ΔcvpA EHEC
DOC (%) Multiple 2.5 0.08
Diamide (mM) Disulfide bond formation 0.6 0.6
H2O2 (mM) Reactive oxygen species 3.2 3.2
Ampicillina (μg/ml) Cell wall damage 7.8 7.8
Piperacillina (μg/ml) Cell wall damage 0.3 0.3
SDSa (%) Detergent 5 5
Polymyxin Ba (μg/ml) Detergent 1.2 1.2
Nalidixic acida (μg/ml) DNA damage 2.5 2.5
a

Compound originally presented in reference 22 and reproduced here for comparison.