Table 1.
Chemicals linked to diseases in each process
| Chemical Name | CAS No | Process in semiconductor | Etc |
|---|---|---|---|
| 1-Methoxy-2-propyl acetate | 108-65-6 | Wafer processing, Chip assembly, Photo (PR solvent) | Common to all processes |
| Acetone | 67-64-1 |
Overall process, Wafer processing, Chip assembly, Mold, Printing, Chip adhesion |
|
| Cresol |
o-Cresol 95-48-7 p-Cresol 106-44-5 m-Cresol 108-39-4 |
Wafer processing, Chip assembly, Mold, Photo (PR solvent), Mold | |
| Ethanol | 64-17-5 | Wafer processing, Chip assembly, Photo (PR solvent), Overall assembly (Cleaning solution) | |
| Hydrogen peroxide | 7722-84-1 | Wafer processing, Chip assembly, Chip adhesion (liquid), Wet etching, wet cleaning, Plating | |
| Isopropyl alcohol | 67-63-0 | Wafer processing, Chip assembly, Photo (PR solvent), Cleaning solution (PM etc.), Maintenance, Washing, Diffusion (liquid, Plating etc.) | |
| n-Butyl acetate | 123-86-4 | Wafer processing, Chip assembly, Photo (PR solvent), Testing etc | |
| Nitric acid | 7697-37-2 | Wafer processing, Chip assembly, Wet etching, Grinding, Wet cleaning, Plating | |
| Potassium hydroxide | 1310-58-3 | Wafer processing, Chip assembly, BSG (Grinding), Plating | |
| Sulfuric acid | 7664-93-9 | Wafer processing, Chip assembly, Wet etching, Wet cleaning, Plating | |
| Tetramethyl ammonium hydroxide |
75-59-2 10,424-66-5 (Trihydrate) 10,424-65-4 (Pentahydrate) |
Wafer processing, Chip assembly, Photo (developer), Rear Grinding | |
| 1-Methoxy-2-propanol | 107-98-2 | Wafer processing, Photo (PR solvent) | Specific to the wafer processing process |
| 2-(2-Aminoethoxy)-ethanol | 929-06-6 | Wafer processing | |
| 2-Ethoxyethanol | 110-80-5 | Wafer processing, Photo (PR solvent) | |
| 2-Heptanone | 110-43-0 | Wafer processing, Photo (PR solvent) | |
| Catechol | 120-80-9 | Wafer processing, Photo (PR removal) | |
| Dibutyl ether | 142-96-1 | Wafer processing, CVD | |
| Ethylene glycol | 107-21-1 | Wafer processing, Dry etching, CVD, Ion implantation (Past 6 inches) | |
| Gamma-Butyrolactone | 96-48-0 | Wafer processing, Photo | |
| Methyl-2-hydroxy isobutyrate | 2110-78-3 | Wafer processing | |
| Methyl-3-methoxy propionate | 3852-09-3 | Wafer processing, Photo (PR solvent) | |
| Nitric oxide (Nitrogen monoxide) | 10,102-43-9 | Wafer processing, Diffusion | |
| Phosphoric acid | 7664-38-2 | Wafer processing, Wet etching | |
| Trimethyl phosphate | 512-56-1 | Wafer processing, CVD | |
| 2-(2-Ethoxyethoxy) ethanol | 111-90-0 | Chip assembly, Mold | Specific to the chip assembly process |
| 2-Butoxyethanol | 111-76-2 | Overall Chip assembly | |
| Acetaldehyde | 75-07-0 | Mold, Chip assembly | |
| Acetic acid | 64-19-7 | Washing, Wet etching, Etching (Wet, liquid), Wafer processing, Washing (Diffusion etc.), Wet etching | |
| Ethyl acetate | 141-78-6 | Chip assembly, Chip adhesion, Mold, Solder ball attachment, Printing (Ink marking) Cleaning solution etc | |
| Glycerol | 56-81-5 | Solder ball attachment, Chip assembly | |
| Heptane | 142-82-5 | Chip assembly, Mold, Photo (developer) etc | |
| Methanesulfonic acid | 75-75-2 | Chip assembly, Plating | |
| Methyl isobutyl ketone | 108-10-1 | Chip assembly, Mold etc | |
| N-Methyl-2-pyrrolidone | 872-50-4 | Chip assembly, Photo (PR removal, developer) | |
| Phenol | 108-95-2 | Chip assembly, Mold, etc | |
| Piperazine | 110-85-0 | Chip assembly, Rear grinding | |
| Polyethylene polypropylene glycol | 9003-11-6 | Chip assembly | |
| Tetrachloroethylene | 127-18-4 | Mold, Chip adhesion, Chip assembly, Testing | |
| Tetrahydrofuran | 109-99-9 | Chip assembly, Rear grinding, Solder ball attachment, Mold, etc | |
| Tin(II) methanesulfonate | 53,408-94-9 | Chip assembly, Plating |
The 25 chemicals including 1-Methoxy-2-propanol are in wafer processing, 26 chemicals including 1-Methoxy-2-propyl acetate are in chip assembly