Table 5.
Several chemical exposure scenarios (ES) in semiconductor manufacturing
Sourced by Kim (2007)
| Chemicals | Exposure scenario (ES) |
|---|---|
| Arsine (CAS No. 7784-42-1) |
Exposure scenario (ES): Semiconductor manufacturing (MP process) In the IMP (Ion implantation) process, work is automatically performed in a closed booth, and the operator is performing tasks such as machine setting and equipment inspection. Workers wear dust-proof clothes, masks, and dust-proof shoes, and a sealed local exhaust system is installed in the workplace |
| Phosphorus oxychloride (CAS No. 10025-87-3) |
Exposure scenario (ES): semiconductor manufacturing (site inspection) Phosphorous oxychloride is used as a stable phosphorus supply in semiconductor factories. Phosphorus acts as a dopant to create an N-type layer on a silicon wafer. Workers when inspecting semiconductor manufacturing equipment and processes may be exposed to phosphorus oxychloride |
| Dioxane (Diethyl dioxide) (CAS No. 123-91-1) |
Exposure scenario (ES): semiconductor manufacturing (site management) During the semiconductor manufacturing process, photoresist (PR) is applied evenly to the wafer surface, which is a light-sensitive material. The photosensitive agent used in this step is made through the PAC process using dioxane, and is used in the process of applying a photoresist, and exposure may occur. Workers may be exposed to dioxane due to leakage during site management |
| Chlorine (CAS No. 7782-50-5) |
Exposure scenario (ES): semiconductor manufacturing (etching work) In semiconductor manufacturing, a crystal product is made using silicon or germanium, cut to the required size, and a wafer is manufactured, and the wafer is made through a semiconductor processing process that undergoes oxidation, etching, diffusion, ion implantation, metallization, etc. Among them, the process that can be exposed to chlorine is an etching process. However, since the process is a closed process, the possibility of respiratory and skin exposure is low. Chlorine is easily vaporized even if it exists in the gaseous or liquid state, so it is unlikely that it will remain in the skin |
| 1,1,2-Trichloroethane (CAS No. 79-00-5) |
Exposure scenario (ES): Used as a washing agent in the semiconductor manufacturing process Trichloroethylene, 1,1,2-trichloroethane, tetrachloroethylene, etc. are used as washing agents in the semiconductor manufacturing process. Immerse the product in the washing liquid to remove impurities. When washing a semiconductor using 1,1,2-trichloroethane, it may be exposed to workers |
| Boron trifluoride (CAS No. 7637-07-2) |
Exposure scenario (ES): For semiconductor manufacturing (doping) Boron trifluoride, which is a dopant gas, is applied to the gate stack and the A surface layer having the source-drain regions, and the source-drain regions are simultaneously diffusion-doped. In this doping process, workers may be exposed |