Skip to main content
. Author manuscript; available in PMC: 2022 May 11.
Published in final edited form as: Anal Chem. 2021 Apr 27;93(18):6924–6931. doi: 10.1021/acs.analchem.1c00870

Figure 1.

Figure 1.

(A) Solidworks rendering of the vT-ESI assembly with labels to identify the significant components. The fan mounted to the top of the device prevents overheating and reduces atmospheric moisture condensation for experiments performed below ~15 °C. The top stage of the thermoelectric chip (TEC) makes direct contact with a 40 mm × 40 mm × 13 mm heatsink (CTS Electronic Components APF40-40-13CB); a 40 mm × 15 mm 24 VDC fan with 14.83 CFM rated airflow (Delta Electronics AFB0424SHB) is used to dissipate the heat off of the heatsink. The vT-ESI assembly uses custom machined PEEK components that mount directly to a commercial Thermo Nanospray Flex source. Additional details about the electronics control system are contained in the Supporting Information. (B) Temperature calibration of the vT-ESI emitter solution is performed using thermocouples inserted into the static spray capillary and the SS heat exchanger (as shown in the inset). The temperature variation ranged from ~±5 °C at the highest and lowest temperature and ~±2 in the range of 5–98 °C.