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. 2021 Apr 13;125(15):3942–3952. doi: 10.1021/acs.jpcb.1c00480

Table 5. Bond Parameters rtarget and r0.

surfactant bead i bead j rtarget r0
MEA AM2 C2 0.65 0.58
MEA AM2 OH 0.68 0.65
TEDA AM2 EO 0.78 0.73
DEA AM3′ C2 0.67 0.62
DEA AM3′ OH 0.67 0.64
HEGA AM3′ OH 0.67 0.64
MEGA AM3 C2 0.68 0.64
MEGA AM3 OH′ 0.68 0.65
XYL ES C2 0.60 0.55
XYL ES OH′ 0.65 0.60
XYL OH′ OH′ 0.45 0.40