Table A1.

Burst load of test chips with 200-mm² chamber area and a 20 × 20 mm² footprint.

Set	I					II		III
Thickness of bonded PMMA part in mm	1.5	1.5	1.5	0.5	0.25	0.5	0.25	1.5	1.5
UV dose in J/cm2	0	0.6	0.6	0.6	0.6	0.6	0.6	-	0.6
Bonding pressure in MPa	2.8	2.4	4.1	2.4	2.4	2.4	2.4	2.4	1.6
Bonding temperature in °C	99	84	84	88	86	84	86	70	70
Burst load in N	42	42, 46, 54	30	13	10, 13	24	13, 19	36	>100