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. 2021 May 31;14(11):2973. doi: 10.3390/ma14112973

Table 2.

High-throughput nanomaterial interconnection fabrication.

Reference Material Method Substrate Curing Printing Speed [m/min] Sheet Resistance [Ω/sq] Resolution [µm]
[53] Graphene Gravure PI Room temperature 0.3 6.25 30
[22] AgNP Inkjet PEN Laser Sintering 10 2.5 50
[155] AgNP Flexography PET 130 °C for 5 min 5 45 150
[35] AgNP Screen PDMS 140 °C for 8 min 2 2.5 125
[50] AgNW Gravure PET 150 °C for 5 min 1.5 mm/s ~20 50–150
[153] AgNW Screen printing PET Flash Light Sintering 0.2 9.6 20
[154] AgNW Gravure PEN 170 °C for 10 min 1 9.3 Film was tested
[88] AgNP Gravure PEN 100 °C for 1 min Not reported, roll-to-roll 4.9 40 mm × 80 mm