Figure 13.

Internal bonding of soy-lignin bonded Rhizophora spp. particleboards at different percentages. C = 0 µm to 103 µm particle sizes; 0 = 0% soy flour and lignin, 6 = 4.5% soy flour and 1.5% lignin, 12 = 9% soy flour and 3% lignin.