Fig. 2. Material structure-property relationships.

a Snapshot image of the MD simulation for the interfacial interaction energy of a SiO₂-PS particle (left panel) and a SiO₂–OH particle (right panel) with the surrounding resins. b Storage and loss modulus of the inks with respect to shear stress. c Viscosity of the inks with respect to shear rate. d Change in the storage and loss modulus of the inks over time. e Stress-strain curves of the inks. The inset graph shows the corresponding results obtained from the ink with 6.0:3.3:0.7 ratio configured into an open mesh layout. f Mechanical hysteresis of the inks for five loading-unloading cycles at a strain of 50%. g Energy loss of the inks (n = 5 per group). h Electrical hysteresis of the inks with respect to the strain from 10 to 50%. i Change in the resistance of the inks throughout 1000 times loading-unloading cycles with the strains ranging from 10 to 30%.