Fig. 1.

UoC design. (A) The 8,960 MEMS elements are on a single transducer-on-CMOS chip, each with control and processing circuitry for sending and receiving ultrasound signals through the acoustic lens of a handheld probe. The integrated MEMS and CMOS structures on a single die can be seen in a scanning electron microscope (SEM) image. The MEMS transducer array is bonded to the CMOS die and bounded by a seal ring. Bond pads to CMOS I/O connections are along the periphery of the CMOS chip. (B) Cross-section of the MEMS ultrasound transducer design. (C) A photograph of the UoC and modules replicated over the chip.