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. 2021 Jul 14;6(29):19006–19016. doi: 10.1021/acsomega.1c02285

Table 2. Thermal Properties of CPI Hybrid Films with Various Organoclay Contents.

  FDN PI
FDN-OH PI
Cloisite 30B in PI (wt %) Tg (°C) TDi a (°C) wtR600 b (%) CTEc (ppm/°C) Tg (°C) TDi (°C) wtR600 (%) CTE (ppm/°C)
0 (pure PI) 230 501 68 63 287 312 63 65
0.25 236 505 67 61 292 314 64 58
0.50 242 512 70 59 302 315 64 57
0.75 238 509 70 62 309 319 64 52
1.00 234 502 68 64 292 311 62 57
a

At a 2% initial weight-loss temperature.

b

Weight percent of residue at 600 °C.

c

Coefficient of thermal expansion obtained in the second heating cycle between 20 and 220 °C.