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. 2021 Aug 3;12:4666. doi: 10.1038/s41467-021-25008-5

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© The Author(s) 2021

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Fig. 1 — a Process for chip-integrated circuit fabrication. Printing using an extrusion printer and the Ag–In–Ga–SIS ink, pick and place of microchips, Pol–Gel transition through solvent vapor exposure, and peeling of the circuit. b Example of a digitally printed circuit with 14 layers of ink. c Schematics of the chip interfacing through Pol–Gel. d Schematics of the ink microstructure before and after vapor exposure. e Side view of a small resistor chip before and after vapor exposure. f A sample with an integrated LED, after being cut, and healed through Pol–Gel, <900% strain. g Side view of a self-encapsulated circuit through Pol–Gel. h Top view of a self-encapsulated circuit through Pol–Gel. i Soft-matter circuit with integrated sensors, microprocessor, and LED display for temperature measurement. j Same circuit was applied to the skin. k Example of a circuit with multiple LEDs under strain. The authors affirm that the human research participant (first author P.L.) provided informed consent for publication of the images in (i, j).