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. 2021 Aug 3;12:4666. doi: 10.1038/s41467-021-25008-5

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© The Author(s) 2021

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Fig. 6 — a Soft-matter circuit with Ag–In–Ga–SIS ink can be produced by extrusion printing, fiber laser patterning, or stencil printing. b Example of an LED display with 60 integrated chips fabricated by extrusion printing and vapor exposure. c An untethered wireless temperature patch with integrated Bluetooth chip, temperature and humidity sensor, microprocessor, resistors, and battery, produced through laser patterning and vapor exposure. The patch sends the data to the mobile phone app. d A condensed soft-matter circuit with temperature sensor and LED display matrix, transferred to the textile through the same Pol–Gel procedure. During the gel state, the SIS substrate penetrates into the fibers of the e-textile, resulting in seamless integration. e Example of a sample with a resistor chip <0–900% strain. The authors affirm that the human research participant (first author P.L.) provided informed consent for publication of the images in (b–d).