Table 1.
Minimum predicted feature size | 0.1 μm |
Image resolution (@ 1.0 kV) | <8.0 nm |
Accelerating voltage range | General purpose 0.5 kV to 30 kV In-Line 0.5 kV to ~2.5 kV |
Magnification | 100 × to 300 000 × |
Wafer size capabilities (in mm) | 100, 125, 150, 200 |
Cleanliness | <2 particles added/pass |
Mean time between failure | >1500 h |
Availability | >95 % |
3S Repeatability (lines and spaces) | Static <5 nm Dynamic <10 nm |
3S Repeatability (contact holes and vias) | Static <10 nm Dynamic <20 nm |
Wafer throughput | >20/h |
Stage speed | >50 mm/s |
Pattern recognition—probability of detection | >99 % |
Pattern recognition—position uncertainty | ±0.2 μm |