TABLE 1.
AM technique | Process | Compatible materials | Advantages | Disadvantages |
Fused deposition modeling (FDM) | Extrusion-based | PLA PCL β-TCP | High mechanical strength. No excess material inside scaffold. | Thermal processing. Low printing resolution (>100 μm). |
Stereolithography apparatus (SLA) | Laser-assisted | HA CA | Cell and bioink carrier potential. Internal resolution. | Limited material diversity. |
Selective laser sintering (SLS) | Laser-assisted | PCL PLA HA | No support structure necessary | Thermal processing |
Three-dimensional printing (3DP) | Binder jetting | PCL | No heat or support structure necessary. | Low mechanical strength. |
Melt electrospinning | Fiber-based | PCL | Tunable fiber thickness (<20 μm). High architectural control. | Limited material diversity. |
PLA, polylactic acid; PCL, polycaprolactone; TCP, tricalcium phosphate; HA, hydroxyapatite; CA, ceramic acrylate.