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. 2021 Aug 23;11(8):292. doi: 10.3390/bios11080292

Table 1.

The most frequently used bonding strength measurement methods and test.

No Name of the Test Required Equipment Measured Value Complexity Special Sample Preparation Requirements Restrictions/Possible Problems Ref.
1 Manual
peeling/
delamination test
Performed
by hand
Bond
formation
(yes/no)
+ - -Only as a first attempt to
verify bond formation.
-Results are subjective.
-A successful bond might be too strong to peel manually.
[19,20,21,34,35,36,37]
2 Adhesive-
assisted tensile strength measurement
Tensile testing
machine,
adhesive
Tensile strength
[Pa]
+ An adhesive must be applied to the samples -The tensile strength of the adhesive bond must be higher than the quantified bond between
PDMS and substrate.
[38]
3 Cylinder-based
tensile strength measurement
Tensile testing
machine
Tensile strength
[Pa]
++ Requires a special
molding form for the PDMS.
-The size of the cylinder should be optimized to avoid rupture, and thin substrates are vulnerable to breaking.
-Due to the special PDMS geometry, it cannot be used on functional
elements or combined
with other test methods.
[39,40]
4 Double-
substrate-bonding-based tensile strength measurement
Tensile testing
machine
Tensile strength
[Pa]
++ Two substrates are required to be bonded to the PDMS. If screws are used to fix the sample to the machine, holes
must be drilled into
the substrate.
-The areas of the two bonds should be precisely controlled, the tensile strength of the bond should be
calculated accordingly.
[41,42]
5 String-based tensile strength measurement (Pull test) Tensile testing
machine
Tensile strength [Pa] +++ The PDMS block and a string should be
cured together.
A drilled hole is needed in the substrate.
-The bond between the string and PDMS is crucial. The string might be torn out from the PDMS block without detaching the PDMS
from the substrate.
-The obtained tensile strength might not be directly comparable
with other methods.
[43,44,45,46,47]
6 Shear strength measurement Shear testing
machine
Shear strength
[Pa](shear strain)
++ The width of the PDMS block should not be wider than the peeling tool. -Parallel forces should be maintained, PDMS bending is a problem.
-The obtained shear strength should be treated with reservations.
[48,49]
7 Lap shear strength measurement Tensile testing
machine
Lap shear strength
[Pa]
++ Either two PDMS blocks are bonded to one substrate or two substrates to one PDMS block. -The sizes of the bonded areas are crucial and should be
properly controlled.
-The shear strength result has to be calculated accordingly.
-The clamping of the PDMS blocks might be difficult.
[50]
8 Peel test Tensile testing
machine, glass slide, adhesive
Peel strength
[N/m]
+++ A partially bonded
flexible foil, is required. The PDMS is bonded to a fixed support
(e.g., a glass slide) with adhesive.
-The pulling angle should be kept 90° during the experiment to ensure
normal forces. The movement of the
supporting glass slide should be
controlled accordingly.
-The strength of the adhesive bond should be higher.
[53]
9 T-peel test Tensile testing machine Peel strength
[N/m]
++ A partially bonded formation is required.
A thin foil or a second PDMS substrate
can be used.
The forces acting on the bond should be kept normal. [54,55]
10 Static leakage test
(durability test)
Ink, tubes,
syringe,
microfluidic cell
Time until leakage
[h]
+ Microfluidic channels are required inside the PDMS block -Proper ink leakage detection.
-Might be time-consuming for good-quality bonds.
[20,40,42]
11 Dynamic leakage test Ink, tubes,
syringe,
microfluidic cell, computer
-controlled pump
Max. flow rate
before
leakage
[mL/min]
++ Microfluidic channels are required inside the PDMS block. Proper ink leakage detection. [19,35,36,38,43,44,45,46,47,50,56,57]
12 Burst test Compressed air or fluid, microfluidic cell, syringe pump, high-pressure tank,
pressure sensor
Burst
pressure
[Pa]
++ A specific blister should be formed in the PDMS block. -The size of the blister is important and should be properly controlled.
-PDMS might explode from the substrate at high pressures.
[21,36,37,38,39,40,41,46,47,48,57,59,60,62]