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. 2021 Aug 20;12(8):991. doi: 10.3390/mi12080991

Figure 6.

Figure 6

An illustration of the mechanism of the BoschTM process for the DRIE etching of silicon [13]. (a) SF6 is used to create the fluorine-based reactive species to etch the silicon. (b) the etch tool turns off the SF6 process gas and switches on the C4F8 process gas. (c) the process gas C4F8 is switched off, the etching process gas SF6 is turned back on. (d) the SF6 is turned off and the polymerization gas C4F8 is turned back on to again.