Table 2.
Methods used in this work to connect the membrane with the PCB.
| Electric Resistance Welding |
Reactive Joining |
Silver Sintering |
TLP Bonding |
|
|---|---|---|---|---|
| Duration of the process preparation 1 | <1 min. | <1 min. | <1 min. | ~2.5 min. |
| Process time | <1 min. | <1 min. | 120 min. | 30 min. |
| Required process energy | Medium | Low | High | High |
| Process material cost | Low | High | High | High |
| Process equipment cost | High | Low | Low | High |
1 Includes the handling of the membrane and the PCB and the preparation of the machine or apparatus.