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. 2020 Nov 16;6:95. doi: 10.1038/s41378-020-00207-0

Fig. 4. Fabricated sensor chip.

Fig. 4

a Chip surface after heavy doping and mask SiO2 removed, b view through the glass after anodic bonding, c SEM of the fabricated resonator, d wafer level of anodic bonding after electrode fabrication, and e the chip size shown after dicing