Figure - PMC

Skip to main content

An official website of the United States government

Here's how you know

Here's how you know

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you've safely connected to the .gov website. Share sensitive information only on official, secure websites.

View full-text article in PMC

. 2019 Dec 30;5:64. doi: 10.1038/s41378-019-0116-8

Search in PMC
Search in PubMed
View in NLM Catalog
Add to search

© The Author(s) 2019

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

PMC Copyright notice

Fig. 1 — a Evolution of C4 solder bumps(adapted from ref. ³³)- The previous technology used ~1:1 aspect ratio SnAg bumps with >100 μm diameter features and >150 μm pitch. Current state-of-the-art technologies use sub-100 μm electroplated copper pillars to reduce the overall footprint of ICs. However, the process limitations of electroplating make it difficult to fabricate large-area, high aspect ratio sub-50 μm resolution structures. The μ-SLS process can enable the fabrication of the next generation of copper pillar-like structures with applications in flip-chip electronics industry. b Ni-Co compliant microforceps fabricated using a hybrid-AM technology useful in minimally invasive microsurgeries (adapted from ref. ³⁴. Reproduced with permission from Emerald Publishing Limited). The high throughput capabilities of μ-SLS process can drive the production scale fabrication of essential microproducts like these. c A representation of large-area fabrication potential (1.2 × 1.2 × 1.2 mm³) of the μ-SLS process. Complex lattice-like microstructures (inset) have applications in developing extremely lightweight structural elements.