Figure 9.
The 3D structure of various MOFs applied in the hole transport layer
(A) CuO@NiO HTL (Shen et al., 2018).
(B) POM@Cu-BTC HTL (Dong et al., 2019).
(C) HTM/In2 (Li et al., 2018).
(D)SP-MOF (Huang et al., 2019).
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