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. 2021 Sep 7;11(9):2329. doi: 10.3390/nano11092329

Figure 8.

Figure 8

(a) Top-view SEM micrograph of the “resist metalens” imprinted at 50 mbar contact pressure and 200 nm resist thickness (b) side-view SEM micrograph of the “resist metalens” imprinted at 50 mbar contact pressure and 200 nm resist thickness after residual layer removal using RIE process; (c) top-view SEM micrographs of the “ resist metalens” imprinted at 150 mbar contact pressure and 500 nm resist thickness and (c’) the respective side view; (d) side-view SEM micrograph after residual layer removal of the “ resist metalens” imprinted at 150 mbar contact pressure and 500 nm resist thickness.