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. 2021 Sep 29;7(40):eabi7410. doi: 10.1126/sciadv.abi7410

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Copyright © 2021 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC).

This is an open-access article distributed under the terms of the Creative Commons Attribution-NonCommercial license, which permits use, distribution, and reproduction in any medium, so long as the resultant use is not for commercial advantage and provided the original work is properly cited.

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Fig. 1. — (A) Scheme of solution gel-shearing process and chain alignment in SUPE film. (B) Comparisons of the thermal conductivity versus dielectric constants for this work and typical polymer dielectric and insulation materials. (C) Crystallinity versus shearing speeds of SUPE films. (D) The d-spacing changes for shearing speed–dependent SUPE films, indicating the lattice strain presence. (E) Scanning electron microscopy image showing a highly aligned fibrous structure induced under shearing speed of 10 mm/s. The corresponding atomic force microscopy image shows the nanofibrous alignment induced by shearing. (F) Flexible and transparent SUPE films. (G) Demonstration of transparent flexible solution sheared UHMWPE coatings for copper wires and copper foils for thermal conductive power infrastructures. Photo credit: Zheng Li, University at Buffalo.